X-Cube technology, announced the industry-first 3D SRAM-logic, by Samsung Electronics for speed and efficiency in Next-generation Applications.
Samsung Electronics is a leading provider of semiconductor technology worldwide. It has always contributed to the world of technology with its transformative technologies and ideas, and has never limited itself to TV and mobile phones. Samsung is now redefining the world of network systems, wearable devices, digital devices, and more.
In its recent press release, the company announces X-Cube (eXtended-Cube), a silicon-proven three dimensional IC technology, immediately available for most advanced high-performance applications. This 3D IC technology relies on Samsung’s TSV (through-silicon) technology, making a positive impact on speed and power efficiency that caters to the need for advanced next-generation applications, including high-performance computing, AI, 5G for mobile networks and other wearables.
This silicon technology by Samsung is available now for advanced nodes, including 7nm and beyond. It is built to suit the custom solution requirements of the consumers with unique needs. That means the customers using this technology can customize the density and the memory bandwidth to their required specifications. The new X-Cube test chip utilizes TSV technology that facilitates freeing up space for more memory. The ultra-thin package design features, enabled by three-dimensional technology, help shorten signal paths to maximize data speed and efficient energy.
The company is planning to collaborate with global fabless customers to open the door for 3D IC solutions’ deployment in the high-performing applications. Monsoo Kang, senior VP for Samsung Electronics (Foundry Market Strategy), said that this immediate release of 3D IC technology would ensure an authentic TSV interconnection even at the EUV process nodes.
He also tweeted that this step will help the company to innovatively push the boundaries of semiconductors to the development of three-dimensional integrated circuits.